Diverse Platinen-Typen

Material  FR4+FPC+FR4
Layer  4 L
Copper foil  1 oz. copper
Board Thickness  1.0 +/- 0.1 mm
Coverlayer  25/35 um
Treatment  ENIG
Solder Mask  Green
Application  Electronic
Material  FR4+FPC+FR4
Layer  4 L
Copper foil  RA copper
Board Thickness 1.6 +/- 0.178 mm
Coverlayer  12/25 um
Treatment  ENIG
Solder Mask  Green
Application  Electronic
Material Rogers 4350
Layer  2 L
Copper foil  H oz.
Board Thickness  0.8 mm
Treatment  ENIG
Solder Mask  Green
Application  Microwave Communication
Material FR-4
Layer  12 L(1+10+1)
Copper foil  H oz.
Board Thickness  0.8 mm
Treatment  ENIG
Solder Mask  Green
Application  Electronic