Platinen für LED Schienen

Material  5052 Aluminium
Layer  1 L
Copper foil  1 oz.
Board Thickness  0.9 mm
conductively PP  k=1-9 w/mk
Treatment  O.S.P.
Solder Mask  White
Application  Monitor / TV
Material  5052 Aluminium
Layer  2 L
Copper foil  1 oz.
Board Thickness  1.05 mm
conductively PP  k=1-9 w/mk
Treatment  H.A.S.L
Solder Mask  White
Application  Monitor / TV
Material  FR-4
Layer  2 L
Copper foil  1 oz.
Board Thickness  0.9 mm
conductively PP  k=1-9 w/mk
Treatment  O.S.P
Solder Mask  White
Application  Monitor / TV
Material CEM-3
Layer  1 L
Copper foil  H oz.
Board Thickness  0.9 mm
conductively PP  k=1.5 w/mk
Treatment  O.S.P
Solder Mask  White
Application  Monitor / TV