PRINTED CIRCUIT BOARDS for
5G TECHNOLOGIES

PRINTED CIRCUIT BOARDS for
5G TECHNOLOGIES

PRINTED CIRCUIT BOARDS for
5G TECHNOLOGIES

Printed Circuit Boards for
Automotive Applications

Printed Circuit Boards for
Automotive Applications

Printed Circuit Boards for
Automotive Applications

The World Of PCB

Development and production of circuit boards and printed circuit boards for industries

For 20 years the Lexington team has been involved in the development, customisation, production, acquisition, marketing and sales of electronics within Europe and the Middle East. During this time, Lexington has built three successful brands.

Since 2008, Lexington Europe GmbH has specialized in the development and production of Printed Circuit Board Technology (PCB). The Lexington team consists of experienced engineers in Germany, modern factories in Asia and a network of national and international partners.

Fair SMTconnect 2023

Visit us! SMTconnect 2023
Nuremberg Fair
09. - 11.05.2023
Hall: 5
Booth: 114a

State-of-the-art PCB technologies

for high-quality electronics in sophisticated industries

Aerospace

Automotive

Communication

Healthcare

Industrial control

Scientific research

Our printed circuit board technologies at a glance

We manufacture and develop the suitable circuit board for many technical requirements. We convince with short delivery times, high quality and sustainable ideas.

HDI printed circuit boards

  • Layer Counts: 1-24 layers
  • 3+N+3 HDI
  • Min. inner layer width/space: 50/50 um
  • Min. Outer layer width/space: 75/75 um
  • Max. Aspect Ratio: 10:1
  • Copper Fill Plating

Multi-Layer printed circuit boards

  • Layer Counts: 2-24 layers
  • 3+N+3 HDI
  • Min. inner layer width/space: 50/50 um
  • Min. Outer layer width/space: 75/75 um
  • Max. Aspect Ratio: 10:1
  • Copper Fill Plating
  • Max. board thickness: 4mm

RIGID-FLEX printed circuit boards

  • 6L Rigid-Flex
  • Min. vias 0.1 mm
  • Outline tolerance +/-50um by using hard die tooling
  • Cyclic Corrosion test 24 hours
  • FPC finished product bending resistance more than 30 times
  • Max. Panel size: 250 mm x 510 mm

FLEX for LED product

  • Roll-shape
  • 255mm width
  • High isolation
  • Withstand voltage: DC6KV, AC4KV

MCPCB

  • 12W IMS material
  • Multi-layer MCPCB capability (Max. 4 layers)
  • Thick Trace Application
  • Max. board thickness 5 mm
  • Trace thickness: 1-4.5 mm
  • E-Charge and Battery management
  • Lexington IMS material for high competitiveness used
  • Max. panel size: 1500 mm x 610 mm

Further interesting topics

from our company

Contact us now

Our experts are at your disposal. We are looking forward to your inquiry!

Abbas Ashkan
Managing director
T +49 (0)2103 9956930
F +49 (0)2103 9956933
M +49 (0)160 93888697
Send E-mail

Hamid Karimzadeh
Authorized signatory
T +49 (0)2103 9956930
F +49 (0)2103 9956933
M +49 (0)173 2097200
Send E-mail

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