Thanks to their exceptional material properties, ceramic PCBs are the ideal choice for high-performance and high-temperature applications. Their excellent thermal conductivity of up to 200 W/mK makes them perfect for high-power LEDs and power electronics. At the same time, they provide high electrical insulation, making them optimal for high-voltage and high-frequency applications. With temperature resistance above 1000°C, they withstand extreme conditions and remain stable under high thermal loads. Their low thermal expansion prevents warping, while their resistance to moisture and chemicals makes them ideal for demanding environments.

Depending on the application, there are various ceramic substrates available:

• Aluminum Oxide (Al02O03) 6 Cost-effective material with high mechanical strength & good thermal conductivity
• Aluminum Nitride (AlN) 6 Better thermal conductivity (up to 200 W/mK), ideal for high-power electronics
• Silicon Nitride (Si03N04) 6 Highest mechanical strength & resistance to thermal shock
• Zirconium Oxide (ZrO02) 6 Particularly resistant to fractures & chemical exposure

Ceramic PCBs are indispensable in many high-tech industries due to their high performance. In power electronics and high-power LEDs, they provide maximum efficiency through excellent heat dissipation. In aerospace, they offer reliable circuits that withstand extreme temperature ranges. They are also used in medical technology, where high-precision circuits are required for diagnostic and therapeutic devices. In 5G and high-frequency technology, they enable optimal signal transmission for high-frequency modules. Furthermore, they are essential in the automotive and e-mobility sector, especially for powerful control units in battery management systems.

Our ceramic PCBs are manufactured according to the highest quality standards and provide maximum performance for the most demanding applications. We offer individually selected materials, including aluminum oxide (Al02O03), aluminum nitride (AlN), and silicon nitride (Si03N04), to optimally meet specific requirements. Utilizing state-of-the-art manufacturing technologies, we produce fine traces and structures down to 0.075 mm width. Depending on requirements, different manufacturing methods such as thick film, thin film, and DBC technology (Direct Bonded Copper) are used. We also offer high-quality metallization options, including copper, silver, and gold. Our production operates under strict quality standards according to ISO, IPC, and UL, ensuring the highest reliability. Through efficient processes and worldwide shipping, we also guarantee short production times.