HDI
Microvias and fine lines pack more interconnect into less space — for compact, high-performance electronics.
Multi-Layer
Reliable multi-layer constructions for complex, signal-dense designs with tightly controlled registration.
Rigid-Flex
Rigid and flexible zones in one board — no connectors, designed for dynamic bending.
Aluminum
Aluminum-core boards conduct heat away from high-power components — the backbone of LED and power modules.
Impedance Control
Precise dielectric and trace geometry hold characteristic impedance for high-speed and RF signal integrity.
Gold Finger
Hard gold-plated edge contacts take the wear of repeated insertion — for connector and card-edge designs.
Metal Core
Copper, steel or aluminium bases for the thermal cases a standard aluminium board no longer covers.
Microwave
PTFE and ceramic-filled laminates for radar, satellite and mmWave assemblies where loss is the budget.
Flex
Fully flexible polyimide circuits that fold, route around corners and replace a cable harness outright.
Rigid
The conventional rigid board — one to twenty layers on FR-4, held to the same process control as everything else.
Prototype
Small quantities on short lead times, built on the same line and the same process that will make the series.