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FR-4 standard

Rigid

The board most projects actually need. Nothing exotic about it, and no reason for it to be anything other than exactly right — which is a question of process control, not of technology.

At a glance
Layers 1 – 20+
Material FR-4, High-Tg
Final thickness 0.4 – 3.0 mm
Line / gap from 75 µm
Testing 100 % electrical

A rigid board is glass-reinforced epoxy with copper on it. That description has not changed in fifty years and it still covers the large majority of electronics built. What has changed is what “standard” means: 100 µm lines, 0.2 mm mechanical vias and ± 10 % impedance are ordinary today and would have been advanced work not long ago.

Because the technology is settled, the differences between suppliers turn up somewhere else — in whether the copper thickness after plating is what the drawing said, whether drill registration holds across the panel, and whether the same board arrives the same way in twelve months. That is the part of a rigid board worth asking about.

Rigid

What it delivers

[ Overview ]
01

Lowest cost per function

For anything that does not have to bend, dissipate unusual heat, or run above a few GHz, a rigid FR-4 board is the cheapest way to build it and will stay that way.

02

Broad material choice

Standard FR-4, High-Tg for lead-free assembly and thicker stacks, halogen-free where the specification demands it — all through the same process.

03

Predictable and repeatable

The value is in the tolerances holding across a series, not in the headline numbers. Every board runs through the same test chain however simple it is.

Build and options

[ Datasheet ]
Feature Specification
Material FR-4, High-Tg FR-4, halogen-free, CEM-1, CEM-3
Layers 1 – 20+
Final thickness 0.4 – 3.0 mm
Copper 18 – 105 µm (standard 18 or 35 µm)
Surface finish ENIG, OSP, immersion silver/tin, lead-free HASL
Solder mask Green, blue, red, black, white
Legend White or black, one or both sides
Typical use Consumer, computing, automotive, appliances, industrial electronics

The usual build for this line. Anything outside it is normally still possible — ask and we will confirm.

Rigid limits

[ Specification ]

Standard runs without a surcharge. Advanced is routine work, but it belongs in the drawing rather than in an assumption.

Parameter Standard Advanced Note
Layers 1 – 8 10 – 20+ Above 8 the build must be symmetrical
Line / gap 100 / 100 µm 75 / 75 µm 75 / 75 µm verified on 18 and 35 µm copper
Mechanical via 0.30 mm 0.20 mm Aspect ratio up to 14:1 at Ø 0.20 mm, 16:1 at Ø 0.25 mm
Annular ring 125 µm 100 µm Measured after plating
Final thickness 0.8 – 2.4 mm 0.4 – 3.0 mm Thin panels need carriers in assembly
Copper 18 – 70 µm 105 µm Heavy copper widens line and gap
Outline tolerance ± 0.15 mm ± 0.10 mm Routed; scored edges are wider
Impedance ± 10 % on review Defined stack-up and coupon; tighter after technical review

Guide values for pre-selection. Binding values are confirmed per project against your data.

Typical applications

[ Use cases ]
Consumer electronics main boards
Computing and server hardware
Domestic appliance controls
Automotive body and comfort electronics
Industrial control and automation
Power supply and charger boards

Design rules

[ Layout ]

The points below are what most often comes back as a query after data review. Settling them before layout freeze saves a loop.

01

Give a stack-up, not just a layer count

“Six layers, 1.6 mm” leaves the dielectric distribution to us. If any signal on the board cares about impedance or crosstalk, the stack-up belongs to the design.

02

Keep the build symmetrical

Copper distribution and dielectric thicknesses should mirror around the centre. Asymmetric builds warp during lamination and again during reflow.

03

Choose the finish for the assembly, not the price

HASL is cheapest and unusable below 0.5 mm pitch. ENIG is flat and keeps for a year. OSP is cheap and flat but has a short shelf life and dislikes multiple reflows.

04

Score only straight, full-length edges

V-scoring is cheaper than routing but works only on continuous straight lines and adds outline tolerance. Anything else has to be routed with tabs.

Frequently asked

[ FAQ ]
When does a rigid board stop being the right answer?

When it has to bend, when heat cannot get out through the laminate, when a BGA drops below 0.5 mm pitch, or when the loss above a few GHz stops closing. Short of that, rigid is almost always the sensible build.

Standard FR-4 or High-Tg?

High-Tg for lead-free assembly, for anything over about eight layers, and wherever the board sees repeated reflow or sustained temperature. The price difference is small and it removes a whole class of delamination risk.

What thickness tolerance should I expect?

Roughly ± 10 % on final thickness, which is the standard for laminated builds. If a connector or an enclosure needs tighter, say so and we will hold it against a measured value.

Do you build single-sided boards?

Yes. They are still the right answer for simple, cost-driven products, and CEM-1 in particular remains sensible for high-volume consumer work.

Related

[ Cross-reference ]

Does this fit your project?

Send us your data or a rough sketch. We check feasibility, name the cost drivers and answer within one working day.