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To the data check →A flex circuit is a conductor pattern on polyimide that bends. It replaces a cable and two connectors with a single part, which is why it usually wins on reliability before it wins on space.
Flex boards are built on polyimide rather than glass-reinforced epoxy, with rolled-annealed copper that tolerates repeated bending in a way electrodeposited copper does not. A coverlay — a second polyimide film bonded over the traces — takes the place of solder resist, because a printed resist cracks the first time the part is folded.
The main design decision is static or dynamic. A static flex is folded once at assembly and then left alone: it can be thicker, carry more layers and use a tighter radius. A dynamic flex bends repeatedly in service and constrains almost everything — single-layer where possible, copper on the neutral axis, generous radii, and no plated hole anywhere near the bend.
One flex circuit instead of a cable, two connectors and two crimps. Fewer parts, fewer joints, and the assembly cannot be plugged in the wrong way round.
It folds into the space that is left rather than demanding a space of its own. In handhelds and instruments that is usually the whole reason.
Rolled-annealed copper on the neutral axis takes millions of cycles. A wire harness in the same place fatigues at the strain relief.
| Feature | Specification |
|---|---|
| Base film | Polyimide, 12.5 – 125 µm |
| Layers | 1 – 6 (single and double-sided are standard) |
| Copper | Rolled-annealed, 12 – 70 µm |
| Coverlay | Polyimide with acrylic adhesive, 12.5 – 25 µm |
| Stiffener | FR-4, polyimide or steel, under connectors and components |
| Final thickness | 0.10 – 0.40 mm in the flexible area |
| Surface finish | ENIG, OSP, immersion tin — ENIG standard |
| Typical use | Wearables, cameras, medical devices, instruments, automotive displays |
The usual build for this line. Anything outside it is normally still possible — ask and we will confirm.
Static and dynamic are two different specifications. The dynamic column below assumes single-layer with the copper on the neutral axis.
| Parameter | Standard | Advanced | Note |
|---|---|---|---|
| Layers | 1 – 2 | 4 – 6 | Every added layer raises the minimum bend radius |
| Bend radius, static | 10 × t | 6 × t | Measured to the inner surface |
| Bend radius, dynamic | 100 × t | 50 × t | Single-layer only, copper on the neutral axis |
| Line / gap | 100 / 100 µm | 75 / 75 µm | Etch tolerance is wider than on rigid |
| Copper | 18 – 35 µm | 12 or 70 µm | RA copper for anything that actually flexes |
| Base film | 25 µm | 12.5 µm | Thinner film bends better and handles worse |
| Hole diameter | 0.30 mm | 0.20 mm | With an annular ring on both sides |
| Stiffener | FR-4 | Steel | Under connectors and every soldered part |
Guide values for pre-selection. Binding values are confirmed per project against your data.
The points below are what most often comes back as a query after data review. Settling them before layout freeze saves a loop.
A via in a bend is a stress concentrator and a guaranteed crack. Keep every hole, pad and stiffener edge at least 1 mm clear of the flexing area.
Traces should cross the bend line at right angles and stay evenly distributed across the width. Traces that run along the bend, or cluster on one edge, tear first.
Sharp corners in the outline or in a trace concentrate strain. Fillet the outline and radius every change of trace direction.
The two have different copper, different layer counts and radii that differ by an order of magnitude. It is the first thing we need to know and the most common omission.
A flex plus connectors is cheaper per part; a rigid-flex removes the connectors and is more reliable. If the rigid ends are simple and the volume is low, flex with connectors usually wins. Once the connector count or the vibration environment rises, rigid-flex pays back.
For a static single fold, roughly six times the total thickness to the inner radius. For dynamic flexing, fifty to a hundred times, single-layer, with the copper on the neutral axis. Anything tighter needs a discussion before layout.
Yes, but not in the flexing area, and every soldered part needs a stiffener underneath. Without one, the reflow and the first flex both work against the joint.
Electrodeposited copper has a columnar grain structure that cracks under repeated bending. RA copper has elongated grains in the plane of the sheet and takes orders of magnitude more cycles.
Send us your data or a rough sketch. We check feasibility, name the cost drivers and answer within one working day.