Market update series Glass fabric, copper foil, AI demand: the current state of PCB base materials. Read the latest post →

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What is happening to capacity, lead times and technology — and the technical pieces that were too long for a FAQ answer.

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Market update

Capacity, lead times and pricing across the PCB supply chain, with what it means for planning rather than just what the index did. The one page to read if you buy boards.

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Articles

5 November 2026 Market update series

Security of supply for PCBs: why vertical integration is becoming more important

When input materials become scarce, the structure of a supply chain comes more sharply into focus. Who controls the glass fabric supply? Where are laminates manufactured? How are available volumes distributed among customers? Vertical integration can make coordination between such manufacturing stages easier. Whether this results in an advantage for a particular PCB project depends, however, on which materials and capacities are actually accessible.

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3 November 2026 Market update series

Dual sourcing alone is not enough: why input materials have to be part of the picture

Two PCB suppliers can make supply more flexible. They do not, however, automatically create two independent material chains. If both purchase the same lami...

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29 October 2026 Market update series

HVLP4 copper foil: why AI hardware places new demands on PCB input materials

In fast electrical connections, the copper surface influences how well a signal reaches its destination. This is becoming increasingly relevant in high-per...

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27 October 2026 Market update series

Copper foil under pressure: can production keep pace with AI demand?

A new production line does not increase the available supply volume immediately. With demanding copper foils in particular, there are several steps between...

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Bare LEXINGTON® multilayer PCB with press-fit holes
26 October 2026 Technical

Quality is no accident: how LEXINGTON® makes process capability measurable

Statistical process control and CpK assessment, using a press-fit hole as the example. Author: Abbas Ashkan | LEXINGTON®

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22 October 2026 Market update series

PCB procurement 2027: why early material planning is becoming more important

Anyone planning PCBs for 2027 has to deal with different market scenarios. The Lexington documents from the summer and September 2026 describe continuing p...

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20 October 2026 Market update series

It is not the PCB that runs short first: the bottleneck begins with the input material

A PCB manufacturer can have free production time and still be unable to start an order on time. The reason may then lie with the right laminate, a prepreg...

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15 October 2026 Market update series

When AI competes for the same materials as automotive

A vehicle control unit and an AI server perform different tasks. In their manufacture, they can nevertheless depend on related input materials and shared p...

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13 October 2026 Market update series

The underestimated cost drivers of a PCB

When the price of a PCB rises, attention often turns to copper first. The raw material is visible and its price development is regularly discussed. The pri...

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8 October 2026 Market update series

Electronic glass fabric is becoming a bottleneck: why the input material for PCBs is growing scarce

Glass is an everyday material. This easily gives the impression that the glass reinforcement of a PCB must also be available at any time. Electronic glass...

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6 October 2026 Market update series

AI is changing the PCB market – why the data centre boom is reaching other industries

Anyone procuring PCBs for an industrial control system does not automatically think of AI data centres. Nevertheless, both applications can be affected by...

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Official EFX 2026 key visual — Expo for Electronics Manufacturing, 6 to 8 October 2026, Messe Stuttgart
13 September 2026 Trade fair

EFX 2026 in Stuttgart: find us in hall 9, stand C29

Electronics manufacturing has a trade fair of its own again: EFX runs in Stuttgart for the first time from 6 to 8 October 2026. We are exhibiting — hall 9,...

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4 August 2026 Market

Why electronic glass fabric affects the entire PCB supply chain

The squeeze starts with an input that appears on no bill of materials: the glass fabric inside the base material. What is behind it, why it will not pass q...

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23 July 2026 Press

LEXINGTON® in the spotlight of Leuze Verlag | Six Sigma PCBs

LEXINGTON® is featured on the Leuze Verlag reference page and on the cover of the latest PLUS magazine — with our Six Sigma quality philosophy and the PCB...

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12 May 2026 Technical

Ceramic PCBs in demanding applications: when they are the right choice

Ceramic PCBs offer high temperature resistance, excellent heat dissipation and reliability in difficult conditions. The real question is not whether cerami...

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12 March 2026 Press

LEXINGTON® on the cover of PLUS magazine — ceramic technology in focus

The March issue of PLUS carries LEXINGTON® on its cover. The subject is the ceramic PCB — and the question of when it is technically needed and when FR-4 r...

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19 October 2025 Technical

Ceramic PCBs: redefining the limits of performance

Conventional base materials like FR-4 are reaching their limits. High-performance applications in e-mobility, 5G, aerospace and industry increasingly turn...

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6 August 2025 Technical

Electronics that move things: what sets an automotive PCB apart

PCBs sit in a vehicle in sensors, the powertrain, lighting and infotainment. What separates such a board from an industrial one is written less into the st...

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Where to meet us

[ Events ]

We exhibit at and attend the European electronics fairs. Rather than publish a schedule that goes stale, we will tell you what is next when you ask.

Trade fairs

The European electronics and PCB fairs. If you are attending one and want half an hour with an engineer rather than a stand conversation, arrange it in advance.

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