PCB Technology
Advanced PCB Technologies for Demanding Applications
LEXINGTON® specializes in three core PCB technology families — each engineered for specific performance requirements. From ultra-compact HDI designs to thermally demanding ceramic substrates and dynamic flexible circuits, we deliver solutions that meet the highest industry standards.
Rigid PCBs — From Standard to Ultra-HDI
Our rigid PCB portfolio spans from standard multilayer boards to ultra-high-density interconnect (Ultra-HDI) designs with up to 40 layers. We handle heavy copper, impedance control (±8%), backdrill, blind & buried vias, and complex stackups for automotive, industrial, and RF applications.
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Up to 40 layers
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Heavy copper up to 6 oz
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Impedance control ±8%
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Backdrill & via-in-pad
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HDI: 1+n+1 to any-layer
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ENIG, ENEPIG, HASL, OSP, Immersion Silver/Tin
Standard · HDI · Ultra-HDI · Heavy Copper
40
Max. Layers
6 oz
Max. Copper
±8%
Impedance Tolerance
0.1 mm
Min. Laser Via
Single-Layer · Multi-Layer · Rigid-Flex
PI / LCP
Base Materials
IPC-6013
Compliance
Dynamic & Static Flex Applications
Aerospace · Medical · Wearables
Flex & Rigid-Flex PCBs
Flexible and rigid-flex circuits enable miniaturization and dynamic bending in applications where traditional rigid boards cannot be used. We manufacture single- and multi-layer flex circuits, as well as complex rigid-flex stackups for aerospace, medical devices, and wearable electronics.
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Single- and multi-layer flex
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Complex rigid-flex stackups
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Dynamic and static flex applications
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Polyimide and LCP substrates
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Fine-pitch applications
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IPC-6013 compliant
Ceramic Substrates — Al₂O₃, AlN, DBC
Ceramic substrates offer superior thermal conductivity, dimensional stability, and electrical isolation for high-power and high-temperature applications. We supply Al₂O₃ and AlN substrates, DBC (Direct Bonded Copper), as well as thick-film and thin-film ceramic circuits for power electronics, LED technology, and sensor applications.
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Al₂O₃ and AlN substrates
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DBC (Direct Bonded Copper)
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Thick-film & thin-film circuits
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Thermal conductivity up to 180 W/mK
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High-power and high-temperature capable
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Custom metallization patterns
Al₂O₃ · AlN · DBC · Thick & Thin Film
180 W/mK
Max. Thermal Conductivity
DBC
Direct Bonded Copper
Power Electronics · LED · Sensors
High-temperature & high-power applications
Certified Excellence
Our commitment to quality and reliability is backed by internationally recognized certifications
Need help choosing the right PCB technology?
Our engineering team is available to discuss your project requirements and recommend the optimal solution.