Capability matrix
[ Core overview ]Standard runs without a query. Advanced is feasible but affects price or lead time. On request means technically possible but project-dependent — let us talk it through.
| Parameter | Standard | Advanced | On request |
|---|---|---|---|
| Layer count | 2 – 16 | 18 – 40 | > 40 |
| Track / gap | 100 / 100 µm | 75 / 75 µm | — |
| Outer copper | 35 µm | 70 – 105 µm | > 105 µm |
| Inner copper | 17 µm | 35 – 70 µm | > 70 µm |
| Board thickness | 0.8 – 2.4 mm | 0.4 – 3.2 mm | < 0.4 / > 3.2 mm |
| Mech. drill Ø | ≥ 0.20 mm | ≥ 0.10 mm | — |
| Microvia Ø | ≥ 0.10 mm | stacked / staggered | — |
| Aspect ratio, rigid | 8 : 1 | 14 : 1 at Ø 0.20 mm · 16 : 1 at Ø 0.25 mm | — |
| Aspect ratio, rigid-flex | 10 : 1 | 12 : 1 | — |
| Annular ring | ≥ 125 µm | ≥ 75 µm | — |
| Solder mask dam | 70 – 150 µm by colour | — | — |
| Impedance tolerance | ± 10 % | — | tighter after technical review |
| Material | FR-4 Tg 150 | High-Tg, halogen-free | Polyimide, ceramic |
| Surface finish | ENIG, imm. tin | Hard gold, OSP, HASL | Combinations |
| Class | IPC-A-600 Cl. 2 | Class 3 | Cl. 3 with docs |
Values apply to standard rigid FR-4 build-ups; the track, gap and annular ring minimums to 18 and 35 µm copper. Advanced values are verified minimums and are confirmed against your data. Rigid-flex and ceramic have their own limits — see the chapters below and the product pages.
01 FR-4, High-Tg, halogen-free, polyimide, ceramic — including IPC slash sheet.
Material choice sets temperature resistance, signal behaviour and price. FR-4 at Tg 150 covers most applications; High-Tg from Tg 170 is recommended for multiple solder cycles and high layer counts.
02 Standard build-ups as a starting point, custom after feasibility review.
Approved standard build-ups are held in stock and noticeably shorten lead time. Custom build-ups are possible but need a feasibility review before ordering.
03 Track width and isolation gap per final copper weight.
The minimum manufacturable structure depends directly on final copper weight — the thicker the copper, the wider track and gap must be. Values apply to outer layers.
04 Impedance definition, material choice, hybrid build-ups, TDR measurement.
Controlled impedance requires a complete statement in the data set: layer, structure, target value and tolerance. Without a reference layer no value can be calculated.
05 PTH / NPTH, microvia, aspect ratio, via pads, press-fit tolerances.
The ratio of board thickness to drill diameter limits platability. Rigid builds are verified up to 14:1 on a 0.20 mm hole and 16:1 on a 0.25 mm hole; rigid-flex runs 10:1 as standard and 12:1 after a special check.
06 Tenting, plugging, filling — effect on assembly and heat dissipation.
Vias in pad must be filled and capped, otherwise solder paste wicks into the hole. Tenting is sufficient for vias outside the solder area.
07 Solder resist to IPC-SM-840, colour options, legend print.
The solder resist protects and defines the solderable areas. The dam between two pads determines how fine assembly can go.
08 ENIG, imm. tin, HASL, OSP, hard gold — thickness, shelf life, suitability.
The finish follows component pitch, soldering process and storage time. For fine pitch and BGA, flat immersion finishes are first choice.
09 Scoring, routing, laser cutting, edge connector bevels, edge plating.
The outline is produced by routing or scoring. Scoring is cheaper but requires rectangular boards in the panel.
10 Panelisation and panel utilisation — a direct lever on unit price.
Utilisation of the production panel often sets the unit price more than the technology does. Adjusting outer dimensions by a few millimetres can lower price noticeably.
11 E-test, AOI, microsection, impedance measurement, X-ray, reliability testing.
Every board is electrically tested. Optical inspection and microsection run alongside production, additional tests on request.
12 IPC-A-600 Class 2 as standard, Class 3 on request, UL, EN 45545-2.
Acceptance criteria follow IPC-A-600. Class 3 applies to safety-critical applications and requires tighter tolerances plus additional documentation.
13 Coverlay for flexible zones, dielectric strength, design rules.
In flexible zones coverlay replaces solder resist. It is mechanically more robust but cannot be structured as finely.
Borderline design?
This page covers the standard. If your layout goes beyond it, we check feasibility against your data — before you freeze the design.