The capability extract shows in thirty seconds what runs as standard and what carries a surcharge.
See capabilities →Send the files and an engineer reviews them against your build — free, before you enquire.
To the data check →The base material sets temperature resistance, signal behaviour, heat dissipation and price — before the first track is drawn. Seven material groups cover everything from standard equipment to high-temperature applications.
The decision almost always comes down to three values: temperature resistance, dielectric constant and price. This overview puts them side by side instead of spreading them across seven pages.
| Material | Tg | Dk (1 GHz) | Cost | Typical use |
|---|---|---|---|---|
| FR-4 | 150 °C | 4.3 – 4.7 | Baseline | Standard electronics, industrial, consumer |
| High-Tg | 170 – 180 °C | 4.2 – 4.6 | + 10 – 20 % | High layer counts, multiple lead-free cycles |
| Halogen-free | 150 – 175 °C | 4.3 – 4.8 | + 10 – 25 % | Railway, environmental rules, EN 45545-2 |
| Copper-based | — | — | + 60 – 120 % | Very high power dissipation, power electronics |
| Polyimide | 250 – 260 °C | 3.4 – 3.6 | + 80 – 150 % | Flex, rigid-flex, high continuous temperature |
| Semi-flex | 150 °C | 4.3 – 4.7 | + 20 – 40 % | One-time bending during assembly |
| Ceramic | — | 9 – 10 | + 200 % | Extreme heat, RF, harsh environments |
Guide values for pre-selection. Specific type designations and datasheets are given per project.
The standard for most applications: glass-reinforced epoxy laminate, widely available and easy to cost.
Higher glass transition temperature for thermally stressed build-ups. Behaves far more stably during soldering than standard FR-4.
Free of bromine and chlorine, lower smoke toxicity in fire. A prerequisite for railway applications to EN 45545-2.
Copper core instead of aluminium for the highest heat dissipation. Used where aluminium is no longer thermally sufficient.
High continuous temperature resistance and excellent flexibility. The base material for flexible and rigid-flex build-ups.
Standard FR-4, controlled-depth routed in the bend zone. The economical alternative to rigid-flex for one-time bending.
Inorganic substrate for extreme temperatures, high power density and RF applications with tight tolerances.
The capabilities page shows which build-ups and layer counts are possible per material. For borderline cases we check feasibility against your data.