EFX 2026 6–8 October, Messe Stuttgart: find us in hall 9, stand C29. Read the post →
Est. 2008

Quality is
no accident.

Six Sigma — perfection in every batch

We manufacture PCBs with the utmost precision and quality — from prototype to volume — giving clients a decisive competitive edge through deep expertise and certified, sustainable production.

Six Sigma distribution curve: the PCB technologies Lexington builds — uHDI, HDI, ceramic, flex and rigid-flex — plotted across a normal distribution.
uHDI HDI Ceramic Flex Rigid-Flex
Market update Electronic glass fabric stays tight — at least 15 % price increase expected for August. As of 31 Jul 2026 Read the update →
18+
Years in PCB
40+
Layer count
75µm
Min. track / gap
100%
Electrical test

Portfolio

[ 06 technologies ]
HDI PCBs

HDI PCBs

Microvias and fine lines pack more interconnect into less space — ideal for compact, high-performance electronics.

Min. line 75 µm
Microvia ≥ 0.1 mm
Stack-up 1+N+1 – 4+N+4
Aspect 1:1
EFX 2026 6–8 October 2026

We are exhibiting in Stuttgart

EFX is the new trade fair for electronics manufacturing — in Stuttgart for the first time, all of it in hall 9. We are there all three days. If you are bringing a live project, arrange half an hour with an engineer in advance rather than a stand conversation.

Hall 9 · Stand C29
Holidays

Important information on the public holidays

1 to 7 October 2026

Please note that the Chinese National Day holiday (Golden Week) may interrupt production and delay logistics during this period.

There is no production and no shipping during this period. Your enquiries will of course continue to be handled.

Please allow for this in your demand and delivery planning.

Capabilities at a glance

[ Extract ]

Does your design run as standard, does it carry a surcharge, or should we talk? The key limits, without an email round-trip.

Parameter Standard Advanced On request
Layer count 2 – 16 18 – 40 > 40
Track / gap 100 / 100 µm 75 / 75 µm —
Outer copper 35 µm 70 – 105 µm > 105 µm
Mech. drill Ø ≥ 0.20 mm ≥ 0.10 mm —
Microvia Ø ≥ 0.10 mm stacked / staggered —
Aspect ratio 8 : 1 up to 16 : 1 —
Surface finish ENIG, imm. tin Hard gold, OSP Combinations
Class IPC-A-600 Cl. 2 Class 3 Cl. 3 with docs
Full values in the delivery specification. Special cases on request. All capabilities →

Why LEXINGTON®

[ 3 pillars ]

We manufacture through an approved partner network. Explained properly that is the advantage: more than one approved plant per technology, our own manufacturing specification and annual audits.

01

Scale & network

Capacity that does not hang on one plant.

Partner plants approved per technology
Always a second source — provable
Reserved capacity for series customers
02

Proximity & support

One contact who understands the layout.

DFM and DRC review before production
Stack-up and impedance calculation
German contracting party, German law
03

Control in the plant

Our own specification, not blind trust.

Requirements beyond IPC Class 2
Annual quality and sustainability audits
8D root cause analysis on complaints
Published
Key figures
98.5 %
On-time delivery
Delivered in full and on time
< 500
ppm complaints
Claims per order line delivered
≥ 1.67
CpK
Process capability in series
100 %
E-test
Every board electrically tested
Who you are dealing with

An engineering office, not a trading desk

LEXINGTON® Europe GmbH specifies, qualifies and controls printed circuit board production in certified plants — with our own CAM, QA and supply chain people standing in them rather than an inbox and a hope. Eight technical specialists in Hilden, and printed circuit boards as the entire subject.

Founded 2012, Hilden
Team 8 specialists
On site Own CAM & QA
Focus PCB only

The process

[ 05 stages ]
  1. 01

    Inquiry & DFM

    Feasibility review and a DFM check on every file.

  2. 02

    Tooling

    CAM prep, stack-up build and impedance modelling.

  3. 03

    Production

    Fabrication on certified, state-of-the-art lines.

  4. 04

    Test & AOI

    100% electrical test plus optical inspection.

  5. 05

    Logistics

    Packed, documented and shipped to schedule.

Industries

[ 05 sectors ]
CpK ≥ 1,67
Process capability index

Series release to IATF 16949, including PPAP sampling and IMDS material documentation.

Tools for engineers

[ Design help ]

Nothing affects cost and reliability as much as the layout. Three pages, written for the point before the first enquiry.

Certified — ISO 13485 ISO 14001 IATF 16949 IPC-A-600 PPAP IMDS Download certificates →
Ready when you are

Your next PCB project

Contact our team and discover how LEXINGTON® can meet your requirements — from prototype to volume.