The capability extract shows in thirty seconds what runs as standard and what carries a surcharge.
See capabilities →Send the files and an engineer reviews them against your build — free, before you enquire.
To the data check →We manufacture PCBs with the utmost precision and quality — from prototype to volume — giving clients a decisive competitive edge through deep expertise and certified, sustainable production.
Layers, tracks, microvias, materials and finishes — every limit at a glance, before you lay out.
See capabilities →ISO 13485, IATF 16949, IPC-A-600 Class 2 and 3, CpK ≥ 1.67 — with certificates and test documentation.
See certificates →Send Gerber data, quantities and target date — you get a clear, individual quotation.
Send enquiry →
Microvias and fine lines pack more interconnect into less space — ideal for compact, high-performance electronics.
Reliable multi-layer constructions for complex, signal-dense designs with tightly controlled registration.
Combine rigid and flexible substrates in one board to eliminate connectors and survive dynamic bending.
Aluminum-core boards conduct heat away from high-power components — the backbone of LED and power modules.
Precise dielectric and trace geometry hold characteristic impedance for high-speed and RF signal integrity.
Hard gold-plated edge contacts take the wear of repeated insertion — for connector and card-edge designs.
EFX is the new trade fair for electronics manufacturing — in Stuttgart for the first time, all of it in hall 9. We are there all three days. If you are bringing a live project, arrange half an hour with an engineer in advance rather than a stand conversation.
Please note that the Chinese National Day holiday (Golden Week) may interrupt production and delay logistics during this period.
There is no production and no shipping during this period. Your enquiries will of course continue to be handled.
Please allow for this in your demand and delivery planning.
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Read →Does your design run as standard, does it carry a surcharge, or should we talk? The key limits, without an email round-trip.
| Parameter | Standard | Advanced | On request |
|---|---|---|---|
| Layer count | 2 – 16 | 18 – 40 | > 40 |
| Track / gap | 100 / 100 µm | 75 / 75 µm | — |
| Outer copper | 35 µm | 70 – 105 µm | > 105 µm |
| Mech. drill Ø | ≥ 0.20 mm | ≥ 0.10 mm | — |
| Microvia Ø | ≥ 0.10 mm | stacked / staggered | — |
| Aspect ratio | 8 : 1 | up to 16 : 1 | — |
| Surface finish | ENIG, imm. tin | Hard gold, OSP | Combinations |
| Class | IPC-A-600 Cl. 2 | Class 3 | Cl. 3 with docs |
We manufacture through an approved partner network. Explained properly that is the advantage: more than one approved plant per technology, our own manufacturing specification and annual audits.
Capacity that does not hang on one plant.
One contact who understands the layout.
Our own specification, not blind trust.
LEXINGTON® Europe GmbH specifies, qualifies and controls printed circuit board production in certified plants — with our own CAM, QA and supply chain people standing in them rather than an inbox and a hope. Eight technical specialists in Hilden, and printed circuit boards as the entire subject.
Feasibility review and a DFM check on every file.
CAM prep, stack-up build and impedance modelling.
Fabrication on certified, state-of-the-art lines.
100% electrical test plus optical inspection.
Packed, documented and shipped to schedule.
Series release to IATF 16949, including PPAP sampling and IMDS material documentation.
Nothing affects cost and reliability as much as the layout. Three pages, written for the point before the first enquiry.
The rules per build, the thirteen faults we find every week, and the checklist to run before you release data.
View →What really sets the unit price: layers, panel use, finish, tolerances.
View →Send the files and an engineer reviews them against your build. Free, no obligation.
Send data →Contact our team and discover how LEXINGTON® can meet your requirements — from prototype to volume.