Blind and buried vias are advanced technologies used to optimize multilayer PCB designs. Blind vias connect outer layers to inner layers, while buried vias are used exclusively for internal connections, resulting in a cleaner external appearance.

These techniques not only enhance electrical performance but also improve thermal distribution and reduce electromagnetic interference. This is especially important in high-density layouts where space is at a premium.

Key benefits of blind and buried vias include:

• Cleaner board surfaces and aesthetically pleasing designs.
• Reduced electromagnetic interference with improved signal quality.
• Efficient utilization of board space in complex designs.

Overall, the use of blind and buried vias enables the production of compact, high-performance PCBs with streamlined routing and enhanced electrical and thermal performance.