Fähigkeiten
LEXINGTON® bietet eine breite Palette von PCB-Fähigkeiten, die auf die spezifischen Anforderungen unserer Kunden zugeschnitten sind. Unsere hochmodernen Fertigungstechniken und unser Fachwissen ermöglichen es uns, Leiterplattenlösungen zu liefern, die höchste Standards in Qualität und Leistung erfüllen.
General PCB Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| Product Type | Backplane, HDI, High multi-layer blind&buried | PCB, Backdrill, Semiconductor Test products; Backplane, HDI, High multi-layer blind&buried PCB, Backdrill |
| Raw Materials type | SY, ITEQ, KB, TUC, Isola, Panasonic, Rogers, Nelco | SY, ITEQ, KB, TUC, Isola, Panasonic, Rogers, Nelco |
| Layer count | 20 layer | 64 layer |
| PCB thickness | 0.2–7mm (No Soldermask); 0.4–7mm (Have Soldermask) | 0.2–7mm (No Soldermask); 0.4–7mm (Have Soldermask) |
| Max finished PCB size | 584.2×889mm (2L); 571.5×850.9mm (4L); 571.5×762mm (6L) | 584.2×889mm (2L); 571.5×850.9mm (4L); 571.5×762mm (6L) |
| Min. finished size | 10×10mm | 10×10mm |
| Ionic soil | ≤1μg/cm² | ≤1μg/cm² |
| Min. bow & twist | 0.75% | 0.05% |
| Impedance tolerance | ±5 Ω (<50Ω), ±10% (≥50Ω) | ±5 Ω (<50Ω), ±10% (≥50Ω) |
Surface Finish Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| Surface Finish Lead Free | ENIG, Hard gold, Flash gold, HASL Lead Free, OSP, ENEPIG, Soft gold, Immersion silver, Immersion Tin, ENIG+OSP, ENIG+Gold finger, Flash gold (electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger | ENIG, Hard gold, Flash gold, HASL Lead Free, OSP, ENEPIG, Soft gold, Immersion silver, Immersion Tin, ENIG+OSP, ENIG+Gold finger, Flash gold (electroplated gold)+Gold finger, Immersion silver+Gold finger, Immersion Tin+Gold finger |
| OSP | 0.12–0.25 μm | 0.2–0.5 μm |
| ENIG | Ni: 3–5 μm; Au: 0.025–0.075 μm | Ni: 5–8 μm; Au: 0.075–0.15 μm |
| Immersion Silver | 0.15–0.5 μm | 0.15–0.5 μm |
| Immersion Tin | 0.8–1.2 μm | 0.8–1.4 μm |
| Hard gold | 0.1–2.0 μm | 0.1–4.0 μm |
| Soft gold | <1 μm | ≥1 μm |
| ENEPIG | Ni: 3–8 μm, Pd: 0.025–0.1 μm, Au: 0.025–0.05 μm | Ni: 5–8 μm, Pd: 0.1–0.5 μm, Au: 0.05–0.1 μm |
| Flash gold (electroplated) | Ni: 3–5 μm; Au: 0.025–0.05 μm | Ni: 5–8 μm; Au: 0.025–0.05 μm |
| Electroplated Gold finger | Ni: 3–5 μm; Au: 0.025–1.27 μm | Ni: 5–8 μm; Au: 1.27–1.51 μm |
| Carbon | 5–25 μm | 5–25 μm |
| Soldermask (Thickness on knee) | ≥5 μm | ≥5 μm |
| Soldermask (Cu Area) | 8–55 μm | 8–55 μm |
Mechanical and Hole Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| MAX thickness of mechanical hole | 0.1/0.15/0.2 mm; 0.8/1.6/2.5 mm | 0.8/1.6/2.5 mm |
| Finished mechanical hole size | 0.15–6.5 mm | 0.1–6.5 mm |
| Min. PTFE & Hybrid Finished Hole size | 0.3 mm (drill tool size 0.4 mm) | 0.25 mm (drill tool size 0.35 mm) |
| Half holes size (min half-hole/pth) | 0.3 mm (drill tool size 0.4 mm) | 0.3 mm (drill tool size 0.4 mm) |
| Via in Pad Hole size | 0.2–1 mm (for 0.4–6 mm board thickness) | 0.2–1 mm (for 0.4–6 mm board thickness) |
| Max aspect ratio (via filled with resin board) | 12:1 | 15:1 |
| Max aspect ratio for Mechanical Holes (20:1 for >0.4 mm; 18:1 for 0.4 mm; 16:1 for 0.25–0.4 mm; 14:1 for 0.15–0.2 mm) |
20:1; 18:1; 16:1; 14:1 | 20:1; 18:1; 16:1; 14:1 |
| Min. depth (backdrill) | 0.2 mm | 0.2 mm |
| Min gap between hole wall and conductor (Normal: 0.14 mm ≤8L, 0.165 mm (10–14L), 0.18 mm (>14L); Advanced: 0.18 mm, 0.23 mm, 0.25 mm) |
0.14–0.18 mm | 0.18–0.25 mm |
| Min space between hole walls (different net) | 0.25 mm | 0.25 mm |
| Min space between hole walls (same net) | 0.15 mm | 0.15 mm |
| Min space between NPTH hole walls | 0.2 mm | 0.2 mm |
| Hole location tolerance | ±0.05 mm | ±0.05 mm |
| NPTH tolerance | ±0.05 mm | ±0.05 mm |
| Pressfit holes tolerance | ±0.05 mm | ±0.05 mm |
| Min Countersink hole size tolerance | ±0.15 mm | ±0.15 mm |
| Min Countersink depth tolerance | ±0.15 mm | ±0.10 mm |
| MAX drilling tool size for via filled with Soldermask (single side; 0.4–5mm / 0.4–6mm boards) |
0.2–0.6 mm (0.4–5 mm) | 0.2–0.65 mm (0.4–6 mm) |
Pad & Copper Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| Min Pad size for mechanical drillings | 0.4 mm (0.2 mm drillings) | 0.4 mm (0.2 mm drillings) |
| Min BGA pad size (HASL: 0.25 mm, LF HASL: 0.3 mm; other tech – 0.25 mm; 0.18 mm ok for flash gold) |
0.25–0.3 mm | 0.25–0.3 mm |
| Pad size tolerance (BGA) (Normal: ±0.038 mm / ±15%; Advanced: ±0.03 mm / ±10%) |
±0.038 mm (≤0.25 mm) or ±15% (>0.25 mm) | ±0.03 mm (≤0.25 mm) or ±10% (>0.25 mm) |
| 1/2 OZ Copper | 75/75 μm | 75/75 μm |
| 1 OZ Copper | 75/100 μm | 75/75 μm |
| 2 OZ Copper | 150/160 μm | 120/130 μm |
| 3 OZ Copper | 180/240 μm | 150/200 μm |
| 4 OZ Copper | 250/300 μm | 200/250 μm |
| 5 OZ Copper | 250/380 μm | 200/330 μm |
| 6 OZ Copper | 280/500 μm | 250/420 μm |
| Ordinary wire width tolerance | 20% | 8%–10% |
| Impedance wire width tolerance | 10% | 5%–10% |
Base Copper & Finishing Details
| Parameter | Normal | Advanced |
|---|---|---|
| Base copper (1/3 oz, 0.5 oz) | ≥35 μm (35–42.5 μm ref.); ≥40.4 μm (40.4–48.5 μm ref.) | ≥35 μm (35–42.5 μm ref.); ≥40.4 μm (40.4–48.5 μm ref.) |
| Base copper (1 oz, 1.43 oz, 2 oz) | ≥55.9 μm; ≥70 μm; ≥86.7 μm | ≥55.9 μm; ≥70 μm; ≥86.7 μm |
| Base copper (3 oz, 4 oz) | ≥117.6 μm; ≥148.5 μm | ≥117.6 μm; ≥148.5 μm |
| Soldermask color | Green, Yellow, Black, Blue, Red, White/Grey/Orange/Purple | Green, Yellow, Black, Blue, Red, White/Grey/Orange/Purple |
| Silkscreen color | White, Yellow, Black | White, Yellow, Black |
| Base copper ≤0.5 oz, Immersion Tin | 0.2 mm (Black), 0.14 mm (Other), 0.2 mm (on copper area) | 0.2 mm (Black), 0.14 mm (Other), 0.2 mm (on copper area) |
| Base copper ≤0.5 oz, Finish treatment (non–Immersion Tin) | 0.14 mm (Black, extremity 0.13 mm), 0.1 mm (Other, extremity 0.09 mm), 0.2 mm (on copper area) | 0.14 mm (Black, extremity 0.13 mm), 0.1 mm (Other, extremity 0.09 mm), 0.2 mm (on copper area) |
| Base copper 1 oz | 0.1 mm (Green), 0.13 mm (Other), 0.14 mm (Black, extremity 0.13 mm), 0.2 mm (on copper area) | 0.1 mm (Green), 0.13 mm (Other), 0.14 mm (Black, extremity 0.13 mm), 0.2 mm (on copper area) |
| Base copper 1.43 oz | 0.1 mm (Green), 0.14 mm (Other), 0.15 mm (Black), 0.2 mm (on copper area) | 0.1 mm (Green), 0.14 mm (Other), 0.15 mm (Black), 0.2 mm (on copper area) |
| Base copper 2 oz–4 oz | 0.15 mm, 0.2 mm (on copper area) | 0.15 mm, 0.2 mm (on copper area) |
V‑CUT Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| H ≤ 1 mm | 0.3 mm (20°), 0.33 mm (30°), 0.37 mm (45°) | 0.3 mm (20°), 0.33 mm (30°), 0.37 mm (45°) |
| 40 < H ≤ 1.6 mm | 0.36 mm (20°), 0.4 mm (30°), 0.5 mm (45°) | 0.36 mm (20°), 0.4 mm (30°), 0.5 mm (45°) |
| 1.6 < H ≤ 2.4 mm | 0.42 mm (20°), 0.5 mm (30°), 0.64 mm (45°) | 0.42 mm (20°), 0.5 mm (30°), 0.64 mm (45°) |
| 2.4 < H ≤ 3 mm | 0.47 mm (20°), 0.58 mm (30°), 0.77 mm (45°) | 0.47 mm (20°), 0.58 mm (30°), 0.77 mm (45°) |
| V‑CUT symmetrical tolerance | ±0.1 mm | ±0.1 mm |
| MAX V‑CUT lines | 100 | 100 |
| V‑CUT angle tolerance | ±5° | ±3° |
| V‑CUT angles | 20°, 30°, 45°, 60°, 90° | 15, 18 |
Gold Finger Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| Gold finger bevelling | 15–45° | 60° |
| Gold finger bevelling tolerance | ±5° | ±5° |
| Min gap between gold finger and edge | 0.2 mm | 0.2 mm |
CNC Routing & Milling
| Parameter | Normal | Advanced |
|---|---|---|
| Depth (Milling) tolerance | ±0.1 mm | ±0.1 mm |
| CNC Routing tolerance (edge to edge) | ±0.1 mm | ±0.1 mm |
Routing/Drilling Slot Tolerances
| Parameter | Normal | Advanced |
|---|---|---|
| Routing slot (PTH) tolerance (w/l) | ±0.13 mm | ±0.13 mm |
| Routing slot (NPTH) tolerance (w/l) | ±0.1 mm | ±0.1 mm |
| Drilling slot (PTH) width tolerance (Length tolerance: ±0.076 mm if L/W ≥2; ±0.1 mm otherwise) |
±0.076–0.1 mm | ±0.076–0.1 mm |
| Drilling slot (NPTH) width tolerance (Length tolerance: ±0.05 mm if L/W ≥2; ±0.076 mm otherwise) |
±0.05–0.076 mm | ±0.05–0.076 mm |
HDI & Laser Drilling Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| HDI type (e.g., 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3 [n ≤0.3 mm]) |
1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3; Laser blind via can be filling plating and any layer Laser | 1+n+1, 1+1+n+1+1, 2+n+2, 3+n+3; Laser blind via can be filling plating and any layer Laser |
| Min laser drilling size | 0.1 mm | 0.1 mm |
| Max laser drilling size | 0.15 mm | 0.15 mm |
| Max aspect ratio (including copper thickness) |
1:1 | 0.9:1 |
| Min gap between hole wall conductor (Laser blind hole: 0.18 mm [1+N+1]; 0.2 mm [1+1+N+1+1 or 2+N+2]) |
0.18–0.2 mm | 0.18–0.2 mm |
| Laser hole – min space between walls (same net) | 0.15 mm | 0.15 mm |
| Min pad size for laser drillings (0.25 mm for 0.1 mm via; 0.28 mm for 0.13 mm via) |
0.25–0.28 mm | 0.25–0.28 mm |
Blind & Buried Via Specifications
| Parameter | Normal | Advanced |
|---|---|---|
| Blind & Buried via type | 3 times lamination | 3 times lamination |
| Min Hole size | 0.1 mm | 0.1 mm |
| Max Hole size | 0.3 mm | 0.3 mm |
| Max aspect ratio (1.3:1 if drill ≤0.2 mm; 1.15:1 if drill ≥0.25 mm) |
1.3:1 / 1.15:1 | 1.3:1 / 1.15:1 |
| Min gap between hole wall conductor (Normal: 0.2 mm, 0.25 mm, 0.3 mm; Advanced: 0.18 mm, 0.2 mm, 0.23 mm) |
0.2–0.3 mm | 0.18–0.23 mm |
| Min space between hole walls (same net) | 0.25 mm | 0.25 mm |
| Min Pad size | 0.25 mm | 0.25 mm |